Semiconductor device modelling
TCAD, MOS structures, transport, traps, interface effects, and model-to-measurement calibration.
nm → μmSpring 2027 master's candidate · Research portfolio
Mechanics to semiconductors.
I am Dilip Khanal, a mechanical engineering graduate building a computational research path across semiconductor devices, materials, and hardware reliability. My work starts with physical models and earns its confidence through experimental validation.
SCROLL TO TRACE THE WORK
01 / Research focus
One foundation.
Three connected scales.
My background is not a conventional straight line into nanoelectronics. That is useful when the problem crosses device physics, mechanics, heat transfer, materials, and manufacturing.
Mechanics and materials
Finite-element thinking, structure–property relationships, nanocomposites, fabrication, and characterization.
μm → mmThermal and multiphysics systems
Heat transfer, CFD, thermo-mechanical reliability, scientific computing, and electronics thermal management.
mm → package02 / Selected work
Evidence before claims.
These projects show the progression from fabrication and characterization toward physics-based simulation and experimentally grounded modelling.
W.01
Frequency dispersion in ultrathin In₂O₃/HfO₂ MOS capacitors
At National Taiwan University, I built and calibrated Silvaco Victory Device models against measured C–V and Gp/ω data. The study showed that distributed bulk traps reproduced the observed frequency dispersion more convincingly than an interface-only explanation.
W.02
Graphene-reinforced PUA for stereolithographic 3D printing
I worked across material preparation, SLA fabrication, mechanical and electrical testing, and characterization. Higher conductivity came with a real trade-off: graphene agglomeration reduced tensile and impact performance.
W.03
Hydrothermal ZnO nanowires for UV sensing
I prepared seeded substrates, grew ZnO nanowires, and used FESEM and EDAX for characterization. Sparse nanowire coverage and substrate-dominated signals exposed the gap between a synthesis result and a reliable device.
03 / Research outputs
Published, presented, contributed.
Springer · 2025
Integration of Nanomaterials in 3D Printing Process for Enhanced Mechanical and Functional Properties
Book chapter in Proceedings in Materials, developed from work presented orally at ASMP 2024, IIT Madras.
Ultra-fast 4-to-2 optoelectronics encoder
Oral conference contribution; device-modelling and manuscript-preparation role.
Internal TCAD research presentation
Presented model calibration and interpretation during the TEEP research visit.
04 / Path
Built across disciplines.
A mechanical foundation, hands-on materials work, and a deliberate move into semiconductor modelling.
Research Visiting Student · National Taiwan University
TEEP-funded research at the Graduate Institute of Photonics and Optoelectronics, focused on experimentally calibrated semiconductor TCAD.
B.Tech., Mechanical Engineering · NIT Tiruchirappalli
First Class, CGPA 7.03/10; final-semester SGPA 9.4/10. The degree was taught entirely in English.
Oral Presenter · ASMP, IIT Madras
Presented graphene–PUA nanocomposite research spanning additive manufacturing, mechanical response, and electrical performance.
Master's research · Spring 2027
Seeking rigorous work in computational engineering, semiconductor devices, multiphysics, thermal transport, or hardware reliability—with a credible path from equations to validation.
05 / Training & recognition
Signals of preparation.
Samsung Fellowship, IISc Semiconductor Workforce Development Program, 2025
CeNSE Summer School, Indian Institute of Science
ESSCI / NSQF Level 6 Foundation Program in Nano Science and Technology
Indian Council for Cultural Relations scholarship, 2021–2025
06 / Contact
Interested in work that connects physical insight to computation.
For research opportunities, graduate supervision, or technical collaboration, contact me directly.